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Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
4 Years
| Ask Lasest Price | |
| Brand Name : | AOK |
| Model Number : | TF300 |
| Certification : | RoHS, Reach, UL |
| Payment Terms : | T/T |
| Delivery Time : | 13-15working days |
Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color/Component A | White | Visual |
| Color/Component B | Light Bule | Visual |
| Density(g/cc) | 3 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
| Viscosity/Component A (cps) | 400000 | ASTM D2196 |
| Viscosity/Component B (cps) | 400000 | ASTM D2196 |
| Hradness,after cure(shore OO) | 40 | ASTM D22240 |
Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each
part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the
product is 6 months after date of shipment.
TF Series Thermal Conductive Gap Filler are two-part, 1:1 ratio,
ceramic filled silicone dispensable gap fillers. Curing at room
temperature lends itself to high volume automation. Typical
applications are where high tolerances are present and designs
require reduced mechanical stresses. Graphene reinforced single component precuring heat conducting gel
is applied to all kinds of components with low stress
requirement to make the products have high reliability. The product
is self-adhesive and easily assembled. Meanwhile, customers
can automatically dispense glue according to their own process to
improve production efficiency.
Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
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