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Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Shenzhen Aochuan Technology Co., Ltd
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    Buy cheap White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound from wholesalers
     
    Buy cheap White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound from wholesalers
    • Buy cheap White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound from wholesalers
    • Buy cheap White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound from wholesalers
    • Buy cheap White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound from wholesalers

    White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

    Ask Lasest Price
    Brand Name : AOK
    Model Number : GF
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

    Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells


    AttributeValueTest Method
    CompositionCeramic filler + Silicone-
    Color/Component AWhiteVisual
    Color/Component BSliver GreyVisual
    Density(g/cc)1.8ASTM D792
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥10.0ASTM D149
    Dielectric Constant(@10mhz)5.5ASTM D150
    Volume Resistivity(Ω.cm)1.0*1015ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)0.8ASTM D5470
    Viscosity/Component A (cps)4500ASTM D2196
    Viscosity/Component B (cps)4500ASTM D2196
    Hradness,after cure(shore OO)60ASTM D22240
    Working Time@25℃(min)30ISO 9048

    Product feature
    ■ Thermal conductivity: 1.0~2.0 W/m.K
    ■ Electrically insulating
    ■ High conformability
    Pls put part A and part B in separate container and stir evenly before mixing the two part together.


    Typical applications
    ■ Industrial: LEDs, Power Supplies
    ■ Automotive: OBC, DC/DC Converter, Amplifiers
    ■ Consumer Electronics: DC Converters, High Voltage Applications


    Purchasing Information

    Packing specification: 50 ml (25 ml each part)/ 400 ml (200 ml each part)/20 kg(10 kg each part)


    Directions for use

    • Working time @ 25C: 30-120 min
    • For best results, ensure a 1:1 mix ratio is maintained
    • Full cure @ 25
    C: 4 hours
    • Full cure @ 100
    C: 5 minutes


    Storage

    Store in a cool, dry, well-ventilated place.


    Shelf life

    Shelf life of the product is 12 months after date of shipment.


    White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

    Quality White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound for sale
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