Sign In | Join Free | My burrillandco.com
burrillandco.com

Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

Active Member

4 Years

Home > Thermal Pad Material >

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Shenzhen Aochuan Technology Co., Ltd
Contact Now
    Buy cheap Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device from wholesalers
     
    Buy cheap Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device from wholesalers
    • Buy cheap Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device from wholesalers
    • Buy cheap Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device from wholesalers

    Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

    Ask Lasest Price
    Brand Name : AOK
    Model Number : TP800
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

    Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device


    AttributeValueTest Method
    CompositionCeramic Filler + Silicone-
    ColorPinkVisual
    Thickness(mm)0.5~10astm d374
    Density(g/cc)3.35ASTM D792
    Hardness(shore oo)55±10ASTM D2240
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)>6.0ASTM D149
    Dielectric Constant(@10mhz)7.2ASTM D150
    Volume Resistivity(Ω.cm)1012ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)8.0±0.5ASTM D5470


    Product feature
    ■ Thermal conductivity:8.0W/m.K
    ■ High thermal conductivity
    ■ Low oil permeability
    ■ High electrical insulation
    ■ High compression rate
    ■ Low compression force


    Typical applications
    ■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
    ■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
    ■ CD ROM/DVD ROM
    ■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.


    Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

    AttributeValueTest Method
    CompositionCeramic Filler + Silicone-
    ColorPinkVisual
    Thickness(mm)0.5~10astm d374
    Density(g/cc)3.35ASTM D792
    Hardness(shore oo)55±10ASTM D2240
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)>6.0ASTM D149
    Dielectric Constant(@10mhz)7.2ASTM D150
    Volume Resistivity(Ω.cm)1012ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)8.0±0.5ASTM D5470
    Quality Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Aochuan Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)