Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Product Categories

Thermal Conductive Pad [58]
Ultra Soft Thermal Pad [56]
Silicone Free Thermal Pad [34]
Heat Sink Thermal Grease [40]
Thermally Conductive Encapsulant [37]
Thermal Conductive Gap Filler [31]
Liquid Gap Filler [26]
Electrical Insulation Sheet [30]
Thermal Pad Material [40]
Thermal Insulation Pad [40]

Shenzhen Aochuan Technology Co., Ltd

Contact Now

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Contact Now

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 ...

Product Tags:

Tasteless Thermal Pad Material

Tasteless IC Thermal Pad Material

Networking IC Thermal Pad

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Aochuan Technology Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!